T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets.
T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules.
With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.
JESD204B Tx-Rx PHY IP, Silicon Proven in SMIC 28SF
The JESD204B Tx-Rx PHY IP interface, which offers full support for the JESD204B synchronous and serial data interface, is aligned…
PCIe 2.0 Serdes PHY IP, Silicon Proven in SMIC 14SF+
The PCIe 2.0 transceiver IP supports all PCIe 2.0 Base applications.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 40ULP
The full gamut of PCIe 2.0 Base operations is covered by PCIe 2.0 transceiver IP.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
The whole spectrum of PCIe 2.0 Base applications is offered by PCIe 2.0 transceiver IP.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 12FFC
A wide variety of PCIe 2.0 Base applications are available with PCIe 2.0 transceiver IP.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 7nm
A comprehensive selection of PCIe 2.0 Base applications is offered by PCIe 2.0 transceiver IP.
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 22ULP
The PCIe 3.0 PHY IP is designed to support increased applications with its low-power, multi-lane, high-performance design.
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
High-bandwidth applications can avail advantage of PCIe 3.0 PHY IP's high performance, multi-lane scalability, and low-power layo…
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 12FFC
To support high-bandwidth applications, PCIe 3.0 PHY IP provides a low-power, multi-lane, high-performance design.
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 7nm
For the high-bandwidth applications, PCIe 3.0 PHY IP offers high-performance, multi-lane capabilities, and low-power design.
PCIe 4.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
For high-bandwidth applications, the PCIe 4.0 PHY IP delivers high-performance, multi-lane capabilities and a low-power design.
PCIe 4.0 Serdes PHY IP Silicon Proven in TSMC 7nm
The high-bandwidth applications benefit from the low power, multi-lane, and high-performance PCIe 4.0 PHY IP's design.
PCIe 5.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
For high-bandwidth applications, the PCIe 5.0 PHY IP offers excellent performance, multi-lane capabilities, and low power design.
LPDDR4/ DDR4/ DDR3L PHY IP - 1866Mbps (Silicon Proven in TSMC 28HPC+)
The LPDDR4/ DDR4/ DDR3L Combo PHY IP offers low latency and supports throughput of up to 1866Mbps.
LVDS/ MIPI Combo PHY IP, Silicon Proven in SMIC 40LL
The MIPI-LVDS Combo Tx IP is designed for chips that perform high bandwidth data communication while operating at low power consu…
V-by-One/LVDS Rx IP, Silicon Proven in SMIC 40LL
V-by-One® HS technology targets a high-speed data transmission of video signals based on internal connection of equipment.
V-by-One/ LVDS Tx IP, Silicon Proven in SMIC 40LL
The V-by-One® HS technology aims to transmit video signals at a high data rate using internal equipment connections.
12.5G Multiprotocol Serdes IP, Silicon Proven in SMIC 12SF++
The multi-protocol SerDes PHY includes Peripheral Component Interconnect Express (PCIe) conforming with PCIe 2.0 Base Specificati…
PCIe 3.0 Serdes PHY IP, Silicon Proven in SMIC 12SF+/SF++
This Peripheral Component Interconnect Express (PCIe) x4 PHY is compliant with PCIe 3.0 Base Specification with support of PIPE 4…
USB 3.1 Type-C PHY IP, Silicon Proven in TSMC 55ULP
USB3.1Type-C PHY IP is a high performance high speed SERDES IP designed for chips that perform high bandwidth data communication …