Overview
This Peripheral Component Interconnect Express (PCIe) x4 PHY is compliant with PCIe 3.0 Base Specification with support of PIPE 4.3 interface spec. Lower power consumption is achieved due to support of additional PLL control, reference clock control, and embedded power gating control. Also, since low power mode setting is configurable, the PHY is widely applicable for various scenarios under different consideration of power consumption.
T2M offers best in class highly configurable PCIe 3.0 PHY, targeted for both enterprise and client application, complaint to PCie 3.0 specification and ECN 1.0a. The PHY IP is designed to support a wide range of applications and can provides maximum throughput through its eight lanes configuration. The customer has a choice to customize it for lower data rates (Gen2) or lower number of lanes. It also supports L1 sub states L1.1 and L1.2 which enables its seamless integration in power constraint applications, while keeping low in the silicon area.
Learn more about Multi-Protocol PHY IP core
Morgan State University (MSU) recently received an Apple Innovation Grant, designed to support engineering schools as they develop their silicon and hardware technologies. The New Silicon Initiative (NSI) is designed to inspire and prepare students for careers in hardware engineering, computer architecture, and silicon chip design.
Increasingly, more of the focus on mobile has centered around cloud datacenters and the networking to get the data back and forth between these datacenters and the mobile device. Functions like voice recognition and mapping depend on the ability to split the functionality between the smartphone, for local processing like encryption and compression, and the back end, where a large number of servers can do the heavier lifting before returning the results.
Steven Brown
The Cadence 10G multi-protocol PHY was architected to address this exact challenge. Designed to scale across multiple process nodes, it consolidates PCI Express (PCIe), USB, DisplayPort, Ethernet, and other interfaces into a single, compact, silicon-efficient block. What sets it apart is simultaneous multi-protocol support, which enables multiple data paths without duplicating hardware, requiring extra board connectors, or paying the area and power penalty of separate IP blocks.
