Vendor: T2M GmbH Category: Multi-Protocol PHY

PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 22ULP

The PCIe 3.0 PHY IP is designed to support increased applications with its low-power, multi-lane, high-performance design.

TSMC 22nm ULP In Production View all specifications

Overview

The PCIe 3.0 PHY IP is designed to support increased applications with its low-power, multi-lane, high-performance design. It fully supports a wide range of PCIe 3.0 Base applications and complies with the PIPE 4.3 specification. By integrating high-speed mixed signal circuits, the IP enables PCIe 3.0 traffic at 8Gbps. It maintains backward compatibility with transfer throughputs of 5.0 Gbps for PCIe 2.0 and 2.5 Gbps for PCIe 1.0. Additionally, it caters to various channel circumstances by supporting both TX and RX equalization approaches.

Key features

  • Compliant with PCIe 3.0 Base Specification
  • Compliant with PIPE 4.3
  • Supported data transfer rate: 2.5 GT/s, 5.0 GT/s and 8.0 GT/s
  • Supported physical lane width: x4
  • Supported parallel interface: 32-bit
  • Supported input reference clock: 100 MHz
  • Supported parallel interface data clock: 62.5 MHz, 125 MHz, and 250 MHz
  • Supporting low power operation with configurable setting in power state P1/P2/L1 PM Substates:PLL control, reference clock control, and embedded power gating control
  • Silicon Proven in TSMC 22ULP
  • Operating Voltage: 0.9V, 0.95V, 1.2V and 1.8V
  • Providing robust testability by low-cost Build-In Self-Test (BIST) via near-end analog and external loopback interface as well as far-end analog/digital loopback interface

Block Diagram

PCIe 3.0 Serdes PHY IP in 22ULP block diagram

What’s Included?

  • GDSII & layer map
  • Place-Route views (.LEF)
  • Liberty library (.lib)
  • Verilog behaviour model
  • Netlist & SDF timing
  • Layout guidelines, application notes
  • LVS/DRC verification reports

Silicon Options

Foundry Node Process Maturity
TSMC 22nm ULP In Production

Specifications

Identity

Part Number
PCIe 3.0 Serdes PHY IP in 22ULP
Vendor
T2M GmbH
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

T2M GmbH
HQ: Germany

Learn more about Multi-Protocol PHY IP core

Frequently asked questions about Multi-Protocol PHY IP cores

What is PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 22ULP?

PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 22ULP is a Multi-Protocol PHY IP core from T2M GmbH listed on Semi IP Hub. It is listed with support for tsmc In Production.

How should engineers evaluate this Multi-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Multi-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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