TSMC tips 450-mm fab
Mark LaPedus, EETimes
1/31/2011 3:33 PM EST
As reported, Intel, Samsung and TSMC are pushing hard for 450-mm fabs. Amid a flurry of speculation, Intel Corp. confirmed that its new fab in the United States is being constructed for the 450-mm wafer era.
Now, TSMC tipped its plans. ''Last week, (TSMC CEO) Morris Chang obsoleted the world’s 300-mm with the blast of a conference call,'' said G. Dan Hutcheson, CEO of VLSI Research Inc., in a report.
To read the full article, click here
Related Semiconductor IP
- Dual Channel 8b D/A Converter - TSMC T40ULP
- Dual Channel 12b D/A Converter - TSMC T40ULP+ESF3
- 8bit D/A Converter - TSMC 22nm ULP
- 12bit 2MSps A/D Converter - TSMC T22ULP
- TSMC 2nm 1V2 GPIO
Related News
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Commentary: Get ready for 450-mm fabs
- Intel, Samsung Electronics and TSMC Reach Agreement for 450mm Wafer Manufacturing Transition
- UMC tips roadmap, questions 450-mm
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder