TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
TSMC is shedding legacy fabs and moving to larger wafers.
By Majeed Ahmad, EETimes | August 13, 2025

After shaking the gallium nitride (GaN) power electronics world by announcing its intention to quit wafer fabrication, TSMC has thrown another stunner—Taiwan’s mega-fab plans to phase out its 6-inch wafer manufacturing over the next two years. This came to light after the company issued a statement of clarification to a news outlet in relation to its plans on the facility.
Following this decision, TSMC has already notified customers that its Fab 2, which produces 6-inch wafers, will cease production in 2027. The company will later provide final wafer schedules and plans to assist them with transfers to other fabs. Currently, TSMC has one 6-inch wafer fab, four 8-inch wafer fabs, and four 12-inch fabs in Taiwan.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related News
- Apple's Shift in Chip Manufacturing Strategy Boosts Semiconductor Foundry Business in 2013
- Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
- Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity
- GlobalFoundries Abandons Chengdu Wafer Fab
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release