Vendor: TES Electronic Solutions Category: DC/DC Converter

DC-DC Split-Pi Boost-Buck Converter

Cascaded 3.3V boost-buck converter running either on a 10V up to 30V supply or on a backup battery supply

X-FAB 180nm XT018 Available on request View all specifications

Overview

The TS_SPLITPI_3V3_X8 is a variable-frequency switching-mode power converter that regulates voltage on terminals V3V3 and VCC2 to typically 3.3V, either from 10V or more on sense-input V24V and power-input PV24V in buck-mode or from battery voltage as low as 1.9V in boost-buck mode, with the addition of discrete inductors, capacitors and diodes.

Mode switchover is controlled by voltage detection on V24V. For a voltage greater than 10V, buck-only mode operation is signalized by ON24V assertion. The minimum bill of material requires the buck inductor, the smoothing capacitor and optionally a polarity-reversal protecting diode between terminals V24V (anode) and PV24V (cathode). V24V is internally protected against voltage polarity reversal before detection.

For circuit applications running on a battery, the bill of material additionally requires the boost inductor, the flyback diode and a smoothing capacitor to terminal PV24V, to achieve a split-pi topology. Boost-buck mode regulation starts for battery voltage on terminal PVBATS greater than 1.9V.

Voltage regulation precision within ±0.1V is achievable for load current intensities up to 200mA in buck-only-mode and up to 133mA in batterysupplied boost-buck-mode.

Power cycling of V3V3 and VCC2 is possible by asserting input BUCKHALT.

Input RUNONVBAT set low turns off the converter, which then draws from a 2.2V battery less than 2.2nA max on PVBATS and 6nA max on PV24V.

The high-side switch between terminals PV24V and SPCOCOM_BUCK is protected against current intensity rising beyond typically 800mA.

Typical power buck conversion efficiency in case of 10V on V24V amounts to 89% at 200mA load, 82% at 25mA and 64% at 12.1mA.

The TS_SPLITPI_3V3_X8 provides its low-pass filtered bandgap reference voltage on pin VBG<2>, typically 1.247V at 27°C junction temperature with a variation of -1.2mV to 150°C.

The TS_SPLITPI_3V3_X8 contains TES junction overtemperature detector IP, TS_TEMP_DET_X8, providing outputs OVERTJ and CENTIGRADE.

The minimum continuous operation lifetime spans 100000 hours.

Technology: X-FAB XT018-0.18μm BCD-on-SOI CMOS

OPERATING CONDITIONS

Parameters Values / Type
Junction temperature range -40ºC up to +150ºC
Supply voltages with respect to ground GNDS and GNDSQ PVBATS: 1.9V up to 3.6V
V24V, PV24V: 10V up to 30V
Maximum DC load current intensity Buck-only mode: 200mA
Boost-buck mode: 133mA
ON24V, VBG<2>, OVERTJ and CENTIGRADE output loads CMOS respectively PMOS gate

SPECIFICATION

Parameters Values / Type
Reference voltage at 27°C junction temperature VBG: 1.247V (±8.5mV)
Reference voltage maximum deviation up to 150°C ΔVBG: -1.2mV (±3.5mV)
V3V3, VCC2 regulated voltage 3.3V (±0.1V)
Switching frequency upon V3V3, VCC2 voltage rising 2MHz (±0.5MHz)
High-side switch on-time without overcurrent-triggered interrupt 420ns (±100ns)
High-side switch current limiter threshold 800mA (±300mA)
2.2V-battery-supplied shutdown current consumption (RUNONVBAT = L, V24V terminal unconnected or grounded) PVBATS: 0.46nA (max 2.2nA, min 0.42nA)
PV24V: 0.1nA (max 6nA, min 0.06nA)
SPCOCOM_BOOST: 28pA (4.1nA, min 7pA)
OVERTJ logic-H voltage VCC2 voltage
Detector low-going temperature threshold (OVERTJ toggles to logic-L as junction temperature falls) 138.2°C ± 5.3°C (± 3 sigma)
Detector hysteresis (high-going low-going temperature threshold difference) 9°C ± 1.5°C (± 3 sigma)
CENTIGRADE output voltage at 10°C junction temperature 99.5mV typical
CENTIGRADE output voltage slope up to 150°C +8.99mV/°C typical
Operating power consumption 252mW max at V(V24V) = 30V, ILOAD = 200mA
Area 1.04mm²

Block Diagram

Silicon Options

Foundry Node Process Maturity
X-FAB 180nm XT018 Available on request

Specifications

Identity

Part Number
TS_SPLITPI_3V3_X8
Vendor
TES Electronic Solutions
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

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Frequently asked questions about DC-DC Converter IP cores

What is DC-DC Split-Pi Boost-Buck Converter?

DC-DC Split-Pi Boost-Buck Converter is a DC/DC Converter IP core from TES Electronic Solutions listed on Semi IP Hub. It is listed with support for x-fab Available on request.

How should engineers evaluate this DC/DC Converter?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DC/DC Converter IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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