Commentary: Get ready for 450-mm fabs
Bill McClean, President of IC Insights Inc.
(10/24/2007 8:03 AM EDT) -- EE Times
IC industry equipment and material suppliers have recently voiced concern regarding the potential move from 300mm wafers to 450mm wafers for the production of ICs.
Demand Side
Some have even stated that this transition is unlikely to ever happen! IC Insights strongly disagrees with this outlook. Although movement to 450mm wafers is not ''just around the corner,'' IC Insights believes that it is only a matter of when, not if, it takes place. IC equipment and materials suppliers may be reluctant participants in 450mm wafer production, but it will happen!
One of the main arguments for moving to 450mm wafers is the reduction of processing cost on a per-square-inch basis. Since the beginning of the IC industry, increasing the wafer size has been an important element in reducing the processing cost per square inch of silicon.
Currently, no IC supplier is even close to optimizing the high-volume manufacturing cost structure for the relatively new 300mm wafer size. However, the idea/dream that 450mm wafers will ultimately be even more cost efficient is one that will not go away.
(10/24/2007 8:03 AM EDT) -- EE Times
IC industry equipment and material suppliers have recently voiced concern regarding the potential move from 300mm wafers to 450mm wafers for the production of ICs.
Demand Side
Some have even stated that this transition is unlikely to ever happen! IC Insights strongly disagrees with this outlook. Although movement to 450mm wafers is not ''just around the corner,'' IC Insights believes that it is only a matter of when, not if, it takes place. IC equipment and materials suppliers may be reluctant participants in 450mm wafer production, but it will happen!
One of the main arguments for moving to 450mm wafers is the reduction of processing cost on a per-square-inch basis. Since the beginning of the IC industry, increasing the wafer size has been an important element in reducing the processing cost per square inch of silicon.
Currently, no IC supplier is even close to optimizing the high-volume manufacturing cost structure for the relatively new 300mm wafer size. However, the idea/dream that 450mm wafers will ultimately be even more cost efficient is one that will not go away.
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Commentary / Analysis: Real men have fabs, but maybe not Infineon, NXP, TI and ST.
- Siroyan multiprocessor to get CoSy compiler treatment
- NEC steps up timetable to build two 300-mm fabs
- Xilinx FPGAs get CoreEl, Memec controller cores
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release