Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.
- UCIe
Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.
UCIe D2D Adapter & PHY Integrated IP
A UCIe solution ready to support any protocol layer The D2D Adapter for UCIe combined with the UCIe PHY from a UCIe solution read…
Accelerated confidence in simulation-based verification of RTL designs with Universal Chiplet Interconnect Express (UCIe) interfa…
Industry , AXI5-Stream Solution for UCIe D2D Stacks The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Strea…
The UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe- (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 spec…
The UCIe IP solution includes D2D Adapter layer which supports streaming/PCIe/CXL/Raw flitformats, supports both standard and mai…
Best-in-Class UCIe Verification IP for your IP, SoC, and System-Level Design Testing The Cadence Verification IP (VIP) for Univer…
The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
The UCIe Chiplet IP offers a cutting-edge solution for seamless, low-latency data transfer between dies and chips, enabling heter…