This datasheet describes the HBM (High Bandwidth Memory) PHY IP, which could be integrated with HBM memory controller to provide …
- Controller + PHY + 1
- TSMC
- 7nm
- N7FF
- Silicon Proven
GLOBAL UNICHIP CORP. (GUC) is a market leader in advanced ASIC (application-specific integrated circuit) services. Our comprehensive design services include ‘spec-in’ and SoC (System-on-Chip) integration, physical implementation, advanced packaging technologies, turn-key manufacturing, as well as cutting-edge technologies such as world-class HBM (high-bandwidth memory) and die-to-die interconnect IPs.
This datasheet describes the HBM (High Bandwidth Memory) PHY IP, which could be integrated with HBM memory controller to provide …
This datasheet describes GUC HBM (High Bandwidth Memory) PHY IP, which could be integrated with HBM memory controller to provide …
TSMC CLN6FF Asynchronous Read Two Port Register File Compiler
IGMDLRX01A is an asynchronous read and synchronous write ULVT periphery two port register file compiler (2PRF).
TSMC CLN6FF/7FF Die-to-Die Interface PHY
This IGAD2DX01A test report shows the functional and characterization test result of GUC Die-to-Die Interface PHY IP for 8 Gbps o…
TSMC CLN16FFC Ternary Content Addressable Memory
IGMTLSLV02A is a synchronous LVT periphery high-density ternary content addressable memory (TCAM).
This datasheet describes GUC’s HBM (High Bandwidth Memory) PHY IP, which can be integrated with HBM memory controller to provide …
TSMC CLN28HPC 12-bit 250MHz Current Steering DAC [2ch]
The IGADACT10A is a general-purpose 2-channel digital to analog converter with 12-bits resolution.
TSMC CLN28HPC+ 2.4GSps Analog Front-End
The IGAAFET05A which contains ADCs, DACs and PLLs is an analog front-end (AFE) IP for RF applications.
TSMC 3nm HBM3-8.6G PHY
TSMC 5nm HBM3-8.4G PHY
TSMC 3nm UCIe-A 32G Die to Die Interface
TSMC 3nm UCIe-A 32G Die to Die Interface
TSMC 5nm UCIe-A 32G LP Die to Die Interface
TSMC 5nm UCIe-A 32G LP Die to Die Interface
TSMC 16nm Thermal Sensor ADC
TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY
IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC packaging solutions, Integrated Fan-Out (InF…
40nm LP 2.5V/1.1V Programmable Sigma Delta ADC [2ch]
40nm LP 2.5V/1.1V Programmable Sigma Delta ADC [2ch]
GLink Multi-Slice PCS (IGPD2D001A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure co…
HBM3 Memory Controller
GLink (GLink-fs 2.x + PCS-replay) CXS-Bridge is a digital IP to interconnect between two dies that use Glink as a physical layer …
GLink (GLink-fs 2.x + PCS-replay) AXI Wrapper is a digital IP designed to support AMBA AXI3/AXI4 compliant bus of user interface …
GLink Multi-Slice PCS (IGDD2D004A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure co…