GUC Announces 2nm 16 Gbps HBM4E IP
Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS®-L advanced packaging technology.
Vendor:
Global UniChip Corp. (GUC)
Category:
ADC
TSMC 16nm Thermal Sensor ADC
TSMC 16nm Thermal Sensor ADC
Overview
TSMC 16nm Thermal Sensor ADC
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 16nm | 16nm 160 nm | — |
Specifications
Identity
Part Number
IGAADCV01A
Vendor
Global UniChip Corp. (GUC)
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
Taiwan
Learn more about ADC IP core
GUC Monthly Sales Report – August 2026
GUC (TAIEX: 3443) today announced its net sales for Aug 2026 were NT5,840 million, increased 1.2% month-over-month and also increased 111.0% year-over-year.
GUC Monthly Sales Report – July 2026
GUC (TAIEX: 3443) today announced its net sales for July 2026 were NT5,769 million, increased 17.1% month-over-month and also increased 158.4% year-over-year.
GUC Monthly Sales Report – June 2026
GUC today announced its net sales for June 2026 were NT4,928 million, increased 5.4% month-over-month and also increased 103.7% year-over-year.
GUC Monthly Sales Report – May 2026
GUC (TAIEX: 3443) today announced its net sales for May 2026 were NT4,674 million, increased 8.8% month-over-month and also increased 132.1% year-over-year.
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Frequently asked questions about ADC IP cores
What is TSMC 16nm Thermal Sensor ADC?
TSMC 16nm Thermal Sensor ADC is a ADC IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub. It is listed with support for tsmc.
How should engineers evaluate this ADC?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this ADC IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.