Vendor: Global UniChip Corp. (GUC) Category: Single-Protocol PHY

GLink Multi-Slice PCS

GLink Multi-Slice PCS (IGPD2D001A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure co…

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Overview

GLink Multi-Slice PCS (IGPD2D001A) is a digital IP used to provide data bus alignment between different GLink Slices to ensure consistent data arriving at the RX side in spite of different delays of TX and RX PCS FIFOs of different slices.
GLink Multi-Slice PCS is a configurable design for a specific multi-slice configuration. By specifying number of user interface and the corresponding data bus width, and whether different user interface would be merged into one GLink Slice, a specific GLink Multi-Slice PCS design could be provided, including RTL code with timing constraints and a testbench.
The Multi-Slice PCS is compatible with any revision of GLink IP, and it provides the error indication in case of alignment fail.

Key features

  • Align data buses of different GLink Slices
  • Compatible with any revision of GLink IP
  • VALID and READY handshake mechanism
  • Support any data bus width
  • Support multiple data buses merge to same GLink Slice
  • Support at most eight combined Slices
  • TX Multi-Slice PCS latency is 0 TX clock
  • RX Multi-Slice PCS latency is default 1 RX clock
  • Provide alignment fail status

Specifications

Identity

Part Number
IGPD2D001A
Vendor
Global UniChip Corp. (GUC)
Type
Silicon IP

Files

Product Sheet Download

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Provider

Contact Global UniChip Corp. (GUC)

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Frequently asked questions about Single-Protocol PHY IP

What is GLink Multi-Slice PCS?

GLink Multi-Slice PCS is a Single-Protocol PHY IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub.

How should engineers evaluate this Single-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Single-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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