Vendor: Global UniChip Corp. (GUC) Category: UCIe

TSMC 5nm UCIe-A 32G LP Die to Die Interface

TSMC 5nm UCIe-A 32G LP Die to Die Interface

Overview

TSMC 5nm UCIe-A 32G LP Die to Die Interface

Silicon Options

Foundry Node Process Maturity
TSMC 5nm N5 —

Specifications

Identity

Part Number
IGAD2DY08A
Vendor
Global UniChip Corp. (GUC)
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about UCIe IP core

GUC Announces 2nm 16 Gbps HBM4E IP

Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS®-L advanced packaging technology.

GUC Monthly Sales Report – July 2026

GUC (TAIEX: 3443) today announced its net sales for July 2026 were NT5,769 million, increased 17.1% month-over-month and also increased 158.4% year-over-year.

GUC Monthly Sales Report – May 2026

GUC (TAIEX: 3443) today announced its net sales for May 2026 were NT4,674 million, increased 8.8% month-over-month and also increased 132.1% year-over-year.

Frequently asked questions about UCIe IP cores

What is TSMC 5nm UCIe-A 32G LP Die to Die Interface?

TSMC 5nm UCIe-A 32G LP Die to Die Interface is a UCIe IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub. It is listed with support for tsmc.

How should engineers evaluate this UCIe?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this UCIe IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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