What is TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY?
TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY is a Custom IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub.
Vendor:
Global UniChip Corp. (GUC)
Category:
Custom
TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY
IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC packaging solutions, Integrated Fan-Out (InF…
Overview
IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions, Integrated Fan-Out (InFO) with the RDL interconnect, and Chip-on-Wafer-on-Substrate (CoWoS@) with the silicon interposer.
Key features
- 56 full-duplex lanes per slice
- 6-Slice/2-Slice PMA included in the analog hard macro
- Lane repair
- Data Bus Inversion (DBI)
- CRC/Parity Check
- Built-in test pattern and checker
- EHOST: APB3, I2C, and JTAG register interface
- Built-in PLL
Specifications
Identity
Part Number
IGPD2DZ01A
Vendor
Global UniChip Corp. (GUC)
Type
Silicon IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
Taiwan
Frequently asked questions about Custom Die-to-Die IP cores
How should engineers evaluate this Custom?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.