Vendor: Global UniChip Corp. (GUC) Category: Custom

TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY

IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC packaging solutions, Integrated Fan-Out (InF…

Overview

IGPD2DZO1A is a high-speed Die-to-Die interface PHY that transmits data through TSMC advanced packaging solutions, Integrated Fan-Out (InFO) with the RDL interconnect, and Chip-on-Wafer-on-Substrate (CoWoS@) with the silicon interposer.

Key features

  • 56 full-duplex lanes per slice
  • 6-Slice/2-Slice PMA included in the analog hard macro
  • Lane repair
  • Data Bus Inversion (DBI)
  • CRC/Parity Check
  • Built-in test pattern and checker
  • EHOST: APB3, I2C, and JTAG register interface
  • Built-in PLL

Specifications

Identity

Part Number
IGPD2DZ01A
Vendor
Global UniChip Corp. (GUC)
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about Custom IP core

GUC Announces 2nm 16 Gbps HBM4E IP

Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS®-L advanced packaging technology.

GUC Monthly Sales Report – July 2026

GUC (TAIEX: 3443) today announced its net sales for July 2026 were NT5,769 million, increased 17.1% month-over-month and also increased 158.4% year-over-year.

GUC Monthly Sales Report – May 2026

GUC (TAIEX: 3443) today announced its net sales for May 2026 were NT4,674 million, increased 8.8% month-over-month and also increased 132.1% year-over-year.

Frequently asked questions about Custom Die-to-Die IP cores

What is TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY?

TSMC CLN3FFE GLink 2.3LL Die-to-Die PHY is a Custom IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub.

How should engineers evaluate this Custom?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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