GUC Announces 2nm 16 Gbps HBM4E IP
Implemented on TSMC's cutting-edge N2P process, the HBM4E PHY has successfully taped out on TSMC CoWoS®-L advanced packaging technology.
IGMTLSLV02A is a synchronous LVT periphery high-density ternary content addressable memory (TCAM).
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| TSMC | 16nm | FFC | Silicon Proven |
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TSMC CLN16FFC Ternary Content Addressable Memory is a FIFO / CAM IP core from Global UniChip Corp. (GUC) listed on Semi IP Hub. It is listed with support for tsmc Silicon Proven.
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this FIFO / CAM IP.
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.