Simplify the Internet of Things connectivity of embedded devices
Meng He, Cypress Semiconductor
Embedded.com (October 13, 2013)
According to ABI Research, there are more than 10 billion wirelessly connected devices in the market today, and more than 30 billion devices will be wirelessly connected to the Internet of Things (Internet of Everything) by 2020.
With so much focus on the Internet of Things, many OEMs find themselves under increasing pressure to introduce Internet connectivity to a wide range of devices that can benefit from being able to communicate with other devices.
However, many developers are unfamiliar with how to implement a robust TCP/IP stack. This article will explore key issues relating to enabling Internet connectivity in embedded systems, as well as discuss how new tools allow developers to introduce TCP/IP to systems without having to work with low-level implementation details.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Articles
- Securing UART communication interface in embedded IoT devices
- MIPI in next generation of AI IoT devices at the edge
- Design considerations for power sensitive embedded devices
- Deciphering phone and embedded security - Part 4: Ideal platform for next-generation embedded devices
Latest Articles
- LACE: Large Language Model Aided Multi-Agent Framework for Agile RISC-V Instruction Extension
- A Process-Aware Hybrid Si/IGO Monolithic-3D 6T SRAM with BEOL Pass-Gates for the 2nm Node
- Automated Estimation of MBIST Area and Test Time in Heterogeneous Memory IPs via Stacked Ensemble Framework
- VIPER: Architecture-Aware Performance Modeling for Processing-in-Memory Design-Space Exploration
- CTTE: An Open Dual-Protocol RISC-V Trace Encoder for N-Trace and E-Trace