Deciphering phone and embedded security - Part 4: Ideal platform for next-generation embedded devices
Mohit Arora, Sr. Systems Engineer and Security Architect, Freescale Semiconductor
EETimes (8/31/2012 5:05 PM EDT)
[Part 1 covers the general Android architecture, including a look at the basic Android platform and the associated framework, as well as commonly used terminology like "rooting" and "flashing." Part 2 takes a deep dive into what really happens at the hardware level during an unlock operation, and tricks that hackers use to fool or bypass bootloaders and install custom ROMs. Part 3 covers various flavors of bootloaders that are offered by the manufacturer to provide levels of protection/security and the way some of them get compromised.]
This is the fourth article in a series and the final one; the first three articles focused on understanding hardware and software aspects of the Android/open system, associated components, along with how hackers bypass security mechanisms to unlock phones as well as defeat security mechanisms in order to get a root access and install custom ROM to customize a phone to suit their needs.
Due to the open nature of Android OS, manufacturers will always be under pressure to provide a mechanism that will allow Android developers to install custom ROMs, which is one of the main attractions for many developers adopting Android. On the other hand, this will always keep a check on security measures that are deployed to be able to meet the best of both the worlds (enough security to protect the consumers that will never customize their phone versus capability to unlock and load custom ROM for developers who wants to customize their phones) versus what could have been done further to strengthen security measures and avoid manipulations.
Leveraging the security solutions described earlier in this series, let's apply them to embedded products other than mobile phones, that do not have this manufacturer dilemma and are mainly concerned with providing reasonable security.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Articles
- Design considerations for power sensitive embedded devices
- Simplify the Internet of Things connectivity of embedded devices
- The evolution of embedded devices: Addressing complex design challenges
- Securing UART communication interface in embedded IoT devices
Latest Articles
- ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs
- ITP-STDP: An Intrinsic-Timing Power-of-Two Learning Engine for On-Chip SNN Training
- OpenEye: A Scalable Open-Source Hardware Accelerator for DNNs
- CHIMERA: A Flexible and Scalable 3.1 TOPS/W AI-MCU with Transformer Accelerator and 563 Gb/s Shared-L2 Memory Subsystem with QoS Guarantees
- CXL-ClusterSim: Modeling CXL-based Disaggregated Memory Cluster for Pooling and Sharing using gem5 and SST