Bridging the gap between custom ASICs and ARM-based MCUs
Mark Saunders, Senior Product Marketing Manager, Cypress Semiconductor
EETimes (10/4/2010 5:53 PM EDT)
One perspective for thinking of the embedded world is as a spectrum of complexity ranging from ASIC to MCU. ASIC designs are enormously expensive and take years to complete but the potential for innovation is almost unbounded. MCU projects are almost free in comparison and take months or even just weeks to finish, but they are limited by the third-party chips they run on.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Articles
- Using customizable MCUs to bridge the gap between dedicated SoC ASSPs, ASICs and FPGAs: Part 1
- Using ARM Processor-based Flash MCUs as a Platform for Custom Systems-on-Chip
- Custom ASICs for Internet of Industrial Things (IoIT)
- Custom Corner Characterization for Optimal ASIC/SoC Designs
Latest Articles
- ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs
- ITP-STDP: An Intrinsic-Timing Power-of-Two Learning Engine for On-Chip SNN Training
- OpenEye: A Scalable Open-Source Hardware Accelerator for DNNs
- CHIMERA: A Flexible and Scalable 3.1 TOPS/W AI-MCU with Transformer Accelerator and 563 Gb/s Shared-L2 Memory Subsystem with QoS Guarantees
- CXL-ClusterSim: Modeling CXL-based Disaggregated Memory Cluster for Pooling and Sharing using gem5 and SST