Bridging the gap between custom ASICs and ARM-based MCUs
Mark Saunders, Senior Product Marketing Manager, Cypress Semiconductor
EETimes (10/4/2010 5:53 PM EDT)
One perspective for thinking of the embedded world is as a spectrum of complexity ranging from ASIC to MCU. ASIC designs are enormously expensive and take years to complete but the potential for innovation is almost unbounded. MCU projects are almost free in comparison and take months or even just weeks to finish, but they are limited by the third-party chips they run on.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related Articles
- Using customizable MCUs to bridge the gap between dedicated SoC ASSPs, ASICs and FPGAs: Part 1
- Using ARM Processor-based Flash MCUs as a Platform for Custom Systems-on-Chip
- Custom ASICs for Internet of Industrial Things (IoIT)
- Custom Corner Characterization for Optimal ASIC/SoC Designs
Latest Articles
- Terracotta: Enabling the Adoption of New DRAM Techniques via a Flexible DRAM Interface and Memory Controller
- A Framework for Accelerating Transformer Inference on RISC-V for Edge AI
- An Interleaved Parallel Dependent Quantization Hardware Architecture for H.266/VVC
- A Formal Security Analysis of CAN XL
- A Secure dToF LiDAR SoC with Dual-Domain Fingerprinting and Event-Driven AFE Circuit Achieving Sensor-Level Attack Resilience