Breaking Down the "Make vs. Buy" Barriers for IP
As the fabless era disaggregated EDA and IP offerings, there are areas where in- house development is still the norm, even with today’s $2.5B IP industry. One of these is on-chip network – connecting the IP cores and memory subsystem.
On-chip interconnect or networks-on-chip (NoCs), in many companies, is still regarded as a part of the IP that can be internally developed for SoCs. With deeper process nodes, such as 28nm, enabling device convergence, more cores are included in the SoC, accelerated further by subsystems.
Related Semiconductor IP
- FlexGen Multi-Die Smart Network-on-Chip (NoC) IP
- NoC Interconnect IP Generator
- AXI NoC Non-Coherent Mesh
- FlexGen Smart Network-on-Chip (NoC) IP
- NoC System IP
Related Blogs
- How Will High-Level Synthesis Affect the Make vs. Buy vs. Re-use Decision?
- Silicon IP for the Final Frontier
- Breaking the Bandwidth Barrier: Enabling Celestial AI’s Photonic Fabric™ with Custom ESD IP on TSMC’s 5nm Platform
- Tape-out Risk in the Age of Edge AI: The Case for GPU IP
Latest Blogs
- Designing for What Comes Next in AI
- Secure boot on Efinix Titanium Ti60: Getting started with KiviBoot-Tiny
- How Long Does It Take to Port a New AI Model? Minutes Now, and Falling
- PCI Express Security and TEE Integration, Part 1 - Establishing Trust
- World Models at the Edge, in Real Time: V-JEPA 2.1 on the Quadric GPNPU