IGAHBMZ03A is a High Bandwidth Memory 4 Physical Layer (HBM4 PHY) that is compliant with JEDEC HBM4 DRAM Specification JESD270-4.
- Controller + PHY + 1
- TSMC
- 3nm
- N3FFP
- Silicon Proven
Semiconductor IP cores (Intellectual Property cores) are reusable design blocks used in SoC and ASIC development to accelerate time-to-market and reduce design complexity.
These IP cores span a broad range of technologies, including Analog & Mixed Signal, Compute Acceleration, Graphics & Vision, Interface Connectivity , Memory Interfaces, Security, Wireless, System Peripheral, Embedded Memories, and Foundation Libraries. The catalog covers everything from analog front-ends, data converters, processors, DSPs, AI accelerators, and imaging solutions to high-speed connectivity, memory controllers and PHYs, cryptographic engines, embedded memory macros, standard cell libraries, and wireless communication IP.
This catalog allows you to explore and compare IP cores from leading vendors, based on performance, power, process node compatibility, and application domain.
Whether you are designing for automotive, wireless communication, consumer electronics, or data centers, you can find the right IP solutions for your system requirements.
IGAHBMZ03A is a High Bandwidth Memory 4 Physical Layer (HBM4 PHY) that is compliant with JEDEC HBM4 DRAM Specification JESD270-4.
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Neuromorphic Processor IP (Second Generation)
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Ku-Band Phased Array Rx-FE in TSMC 180nm RF
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USB 3.0 Device Upgrade IP Core
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High Speed Inter-CHIP USB 2.0 PHY
USB is the ubiquitous peripherals interconnect of choice for a large number of computing and consumer applications.
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UFS Hardware Validation Platform (HVP)
Universal Flash Storage (UFS) is a simple, high performance, mass storage device with a serial line interface.
The Universal Flash Storage (UFS) is a JEDEC data transfer standard is designed for mobile systems.