Vendor: Arasan Chip Systems Inc. Category: USB

USB 3.0 Device

The USB 3.0 Device IP core enables designers in the PC, mobile, consumer and communication markets to bring significant power and…

Overview

The USB 3.0 Device IP core enables designers in the PC, mobile, consumer and communication markets to bring significant power and performance enhancements to the popular USB standard while offering backward compatibility with billions of USB-enabled devices currently in the market.

Arasan provides designers with a comprehensive, silicon-proven configurable digital USB 3.0 Device solution that conforms to the latest USB 3.0 specification. Support for both USB 3.0 and USB 2.0 functionality, the IP core provides the greatest flexibility for all applications. The Device IP core is designed to seamlessly integrate into any SoC design for an easy and cost effective solution.

The USB 3.0 Device provides a dedicated dual simplex, routable packet architecture for USB3.0 and USB 2.0 packet transfers, with a disable option for power savings. The Arasan USB 3.0 IP supports all power management features as well as a dedicated link manager for each downstream port for increased efficiency. It includes a high performance scatter-gather DMA that can be configured to access any endpoint through registers. Optionally, it can interface with an external DMA controller.

The USB 3.0 Device IP core provides an UTMI/ULPI interface for USB 2.0 support and a PIPE interface for USB 3.0 support.

The USB 3.0 Device IP Core utilizes a flexible system bus architecture that can support AXI, AHB, OCP or any custom system interface needed for existing SoC development. The system bus can also be replaced with a dedicated FIFO interface to reduce bus bandwidth issues. The IP core includes RTL code, test scripts and a test environment for complete design verification.

Key features

  • USB 3.0 Compliance
  • SuperSpeed: 5 Gbit/s
  • Hish Speed: 480Mbit/s
  • Full Speed: 12Mbit/s
  • 8/16/32 bit USB 3.0 PIPE interface
  • 8/16 UTMI/ULPI interface
  • Master DMA implementation for each endpoint with Scatter Gather support
  • Optional slave DMA interface for external DMA implementations (auto mode)
  • System bus Master/Target clock
  • SuperSpeed Clock: 125/250/500 MHz
  • High and Full Speed Module: 30/60 MHz
  • Configurable up to 15 Tx and 15 Rx endpoints
  • Configuration options: Bulk, control, isochronous, interrupt
  • Dedicated control endpoint zero
  • Configurable dual port RAM shared between endpoints
  • Separate RAMs for upstream and downstream traffic
  • All power states as specified in USB 3.0 specifications
  • 32/64 bit AXI, AHB or OCP bus interface
  • Seamless integration interface to Arasan PCI Express endpoint IP

Block Diagram

Benefits

  • Fully compliant core
  • Premier direct support from Arasan IP core designers
  • Easy-to-use industry standard test environment
  • Un-encrypted source code allows easy implementation
  • Reuse Methodology Manual guidelines (RMM) compliant verilog code ensured

What’s Included?

  • RMM Compliant Synthesizable RTL design in Verilog
  • Easy-to-use test environment
  • Synthesis scripts
  • Technical documents

Specifications

Identity

Part Number
USB 3.0 Device
Vendor
Arasan Chip Systems Inc.
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about USB IP core

SuperSpeed USB 3.0: Ubiquitous Interconnect for Next Generation Consumer Applications

To address the bandwidth limitations of the USB 2.0 interface, the USB Implementers Forum (USB-IF) released the SuperSpeed USB 3.0 specifications in November 2008. The USB 3.0 specification provides a maximum bandwidth of up to 5Gbps while limiting power consumption. In this white paper we present the features of the USB 3.0 protocol, discuss the new usage models it enables and compare it with some of the existing interface standards popular in the market today.

eUSB2V2: Trends and Innovations Shaping the Future of Embedded Connectivity

In an era defined by rapid technological advancement, embedded interfaces must evolve to meet the demands of smaller form factors, lower power budgets, and diversified use cases. Among these interfaces, eUSB2V2 (Embedded USB 2.0 Version 2) has emerged not just as a legacy-support PHY, but as a strategic enabler of robust, low-power connectivity across next-generation systems-on-chip (SoCs).

Frequently asked questions about USB IP cores

What is USB 3.0 Device?

USB 3.0 Device is a USB IP core from Arasan Chip Systems Inc. listed on Semi IP Hub.

How should engineers evaluate this USB?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this USB IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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