Universal Chiplet Interconnect Express(UCIe) VIP
The UCIe VIP , a solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of y…
- Verification IP
UCIe IP cores enable high-bandwidth die-to-die connectivity in advanced packaging and chiplet architectures in modern SoC and ASIC designs.
These IP cores support standardized die-to-die connectivity for chiplet-based architectures with high bandwidth and ecosystem interoperability, helping designers scale heterogeneous integration with better bandwidth density, packaging flexibility, and subsystem reuse
This catalog allows you to compare UCIe IP cores from leading vendors based on bandwidth, latency, power efficiency, and process node compatibility.
Whether you are designing chiplet SoCs, AI packages, data-center processors, or advanced packaging platforms, you can find the right UCIe IP for your application.
Universal Chiplet Interconnect Express(UCIe) VIP
The UCIe VIP , a solution that offers a comprehensive set of features and capabilities to ensure the quality and performance of y…
The UCIe IP solution includes D2D Adapter layer which supports streaming/PCIe/CXL/Raw flitformats, supports both standard and mai…
UCIe-S PHY for Standard Package (x16) in TSMC N6, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in TSMC N4P, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A PHY for Advanced Package (x64) in TSMC N3E, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x32) in TSMC N3P, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-A (Gen2) PHY for Advanced Package (x64) in Intel 18A, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x32) in TSMC N3P, East/West Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
The UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hyperscale …
Universal Chiplet Interconnect Express (UCIe™) PHY and Controller
High-bandwidth, low-power and low-latency standardized die-to-die interconnect
UCIe-S (Gen2) Compatible PHY for Standard Package (x16) in TSMC N3P, North/South Orientation
Synopsys UCIe PHY IP enables high-bandwidth, low-power, and low-latency die-to-die connectivity in a multi-die package for hypers…
SmartDV’s UCIe 3.x Controller IP is a next-generation Universal Chiplet Interconnect Express solution engineered for the most dem…
SmartDV’s CHI to UCIe Bridge IP enables seamless protocol translation between Arm’s Coherent Hub Interface (CHI) and the Universa…
UCIe Controller (CHI Protocol + Adapter)
The UCIe Controller consists of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) Adapter and Protocol Layers.
UCIe Controller (AXI Protocol + Adapter)
The UCIe Controller consists of Universal Chiplet Interconnect Express (UCIe) Die-to-Die (D2D) Adapter and Protocol Layers.
Die-to-Die (D2D) Interface for Chiplet Application
Compliant with the UCIe Specification Revision 1.1
UCIe D2D Adapter & PHY Integrated IP
A UCIe solution ready to support any protocol layer The D2D Adapter for UCIe combined with the UCIe PHY from a UCIe solution read…
ForwardEdge’s UCIe IP enables scalable die-to-die connectivity for chiplet-based SoCs.
The UCIe PHY IP enables high-bandwidth, low-latency die-to-die communication across chiplets, fully compliant with the Universal …