C2C (Chip-to-Chip) interface IP
C2C&D2D Combo (UCIe-based) IP compliant with UCIe specification
Overview
The C2C (Chip-to-Chip) interface IP is a high-performance, low-latency, and power-efficient chip-to-chip interconnect solution designed for advanced multi-chiplet systems, AI accelerators, high-speed computing, and networking SoCs. It enables seamless, reliable data transmission between separate chips or heterogeneous dies through package interposer or PCB traces.
MSquare offers this silicon-proven IP with unique hybrid analog/digital architecture which has low power, compact area and robust performance. This UCIe&C2C combo IP contains Die-to-Die adapter layer and physical layer, each layer contains a sideband interface to provide a back-channel for link training and access of registers of the link partner.
Key features
- C2C&D2D Combo (UCIe-based) IP compliant with UCIe specification
- Standard Package with PCB, channel reach up to 100mm
- 16-TX and 16-RX per-module, IO rate up to 32Gbps and independent full-duplex
- Total solution with Controller+PHY
- Supports AXI4/CXS.b interface (512-bit data width @1GHz Clock)
Specifications
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Files
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Frequently asked questions about Custom Die-to-Die IP cores
What is C2C (Chip-to-Chip) interface IP?
C2C (Chip-to-Chip) interface IP is a Custom IP core from MSquare listed on Semi IP Hub.
How should engineers evaluate this Custom?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.