Trusted Autonomy with Cadence Super Agents & NVIDIA Open Agent Safety Platform
Cadence AI Super Agents bring engineering trusted autonomy to semiconductor workflows, enabled by NVIDIA Open Agent Safety Platform.
Vendor:
Cadence Design Systems, Inc.
Category:
Custom
Simulation VIP for AMBA CXS
Cadence provides a mature and comprehensive Verification IP (VIP) for the CXS specification which is part of the Arm® AMBA® famil…
Overview
Cadence provides a mature and comprehensive Verification IP (VIP) for the CXS specification which is part of the Arm® AMBA® family of protocols. Incorporating the latest protocol updates, the Cadence® VIP for CXS is designed for easy integration in testbenches at IP, system-on-chip (SoC), and system levels. The VIP helps you reduce time to test, accelerate verification closure, and ensure end-product quality. The CXS VIP runs on all major simulators and supports SystemVerilog and e verification languages along with associated methodologies, including the Universal Verification Methodology (UVM) and Open Verification Methodology (OVM).
Supported specification: AMBA CXS v2.0 and Issue B update.
Key features
- CCIX Support
- Packs and unpacks CCIX messages to interface Arm interconnects (CMN600, CMN700, others) with CCIX support and works seamlessly with CCIX PRL VIP
- Transaction Types
- Supports monitoring and driving of all transaction types
- Credit Grant
- Supports different credit grant allocation modes
- Delay Control
- Delay controls for all interface signals
- Multiple Packets in Single Flit
- Supports multiple packets in a single flit
- Data Check
- Data parity checks
- Ignore Deactivation Hint
- Supports ignoring deactivation hint
- Replication
- Supports replication mode
- Continuous Data
- Supports continuous data mode
Block Diagram
Simulation VIP for AMBA CXS block diagram
Specifications
Identity
Part Number
Simulation VIP for AMBA CXS
Vendor
Cadence Design Systems, Inc.
Type
Verification IP
Files
Note: some files may require an NDA depending on provider policy.
Provider
HQ:
USA
Learn more about Custom IP core
Cadence Collaborates With TSMC to Deliver Certified Tool Solutions and Industry-Leading, Silicon-Proven UALink IP on TSMC Advanced Processes
Expanded partnership spans TSMC A14 certification, silicon-proven IP on TSMC N3P/N2P, wafer-scale 3D-IC for hundreds of chiplets, and agentic AI flows
Cadence Expands ChipStack AI Super Agent with a New Agent for RTL Generation and Early PPA Optimization
New AI agent leverages core EDA technologies to both create RTL from specifications and upgrade RTL with signoff‑grade quality and performance, validated in early trials with Honda
Cadence Tensilica IP Powers Analog Devices’ Next-Generation DSP Architecture
The joint effort brings Cadence’s highly optimized Tensilica DSP architecture into the next-generation ADSP product family from ADI, enabling richer audio experiences, enhanced voice interactions, and greater system intelligence for future automotive platforms.
Cadence Subsystem for PCIe 6.0 Architecture Achieves First-Pass PCI Express Specification Compliance
Complete x8 subsystem solution in TSMC N3 process demonstrates industry readiness for mass production and de-risks adoption for AI/HPC customers
DDR5 MRDIMM Gen2: The Missing Link in Scaling AI Infrastructure
Cadence leads the market with its DDR5 MRDIMM 12.8 Gbps Gen2, TSMC N3P IP system solution, establishing a new benchmark for industry-leading PPA. Key industry leaders have already adopted this solution, which is now also available in the TSMC N2P and N5/N4P process nodes.
Frequently asked questions about Custom Die-to-Die IP cores
What is Simulation VIP for AMBA CXS?
Simulation VIP for AMBA CXS is a Custom IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.
How should engineers evaluate this Custom?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.