PHY and SerDes IP cores are essential building blocks for high-speed data transmission in modern semiconductor designs. This category includes physical layer IP and serializer/deserializer solutions used to implement reliable chip-to-chip, die-to-die, backplane and interface connectivity across networking, compute, storage, automotive and consumer applications.
Browse PHY / SerDes semiconductor IP for high-speed interfaces requiring robust signal integrity, scalable lane configurations, low power and standards-oriented interoperability. Compare controller-adjacent PHY IP, generic SerDes architectures and specialized high-speed connectivity solutions from multiple vendors for integration into ASICs, SoCs and advanced package designs.
USB 3.2 Gen2 PHY IP, Silicon Proven in TSMC 12FFC
All USB 3.2 Gen2X1 host and peripheral applications are supported up to 10Gbps by the USB 3.2 Gen2X1 transceiver IP.
USB 3.2 Gen2 PHY IP, Silicon Proven in TSMC 7FF
The USB 3.2 Gen2X1 transceiver IP offers all USB 3.2 Gen2X1 host and peripheral applications up to 10Gbps.
GbE (10/100/1000 Base-T) PHY IP, Silicon Proven in TSMC 28HPC+
For Gigabit 10/100/1000 Ethernet applications, the GPHY is a integrated single chip.
PCIe 2.0 Serdes PHY IP, Silicon Proven in SMIC 14SF+
The PCIe 2.0 transceiver IP supports all PCIe 2.0 Base applications.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 40ULP
The full gamut of PCIe 2.0 Base operations is covered by PCIe 2.0 transceiver IP.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
The whole spectrum of PCIe 2.0 Base applications is offered by PCIe 2.0 transceiver IP.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 12FFC
A wide variety of PCIe 2.0 Base applications are available with PCIe 2.0 transceiver IP.
PCIe 2.0 Serdes PHY IP, Silicon Proven in TSMC 7nm
A comprehensive selection of PCIe 2.0 Base applications is offered by PCIe 2.0 transceiver IP.
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 22ULP
The PCIe 3.0 PHY IP is designed to support increased applications with its low-power, multi-lane, high-performance design.
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
High-bandwidth applications can avail advantage of PCIe 3.0 PHY IP's high performance, multi-lane scalability, and low-power layo…
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 12FFC
To support high-bandwidth applications, PCIe 3.0 PHY IP provides a low-power, multi-lane, high-performance design.
PCIe 3.0 Serdes PHY IP, Silicon Proven in TSMC 7nm
For the high-bandwidth applications, PCIe 3.0 PHY IP offers high-performance, multi-lane capabilities, and low-power design.
PCIe 4.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
For high-bandwidth applications, the PCIe 4.0 PHY IP delivers high-performance, multi-lane capabilities and a low-power design.
PCIe 4.0 Serdes PHY IP Silicon Proven in TSMC 7nm
The high-bandwidth applications benefit from the low power, multi-lane, and high-performance PCIe 4.0 PHY IP's design.
PCIe 5.0 Serdes PHY IP, Silicon Proven in TSMC 16FFC
For high-bandwidth applications, the PCIe 5.0 PHY IP offers excellent performance, multi-lane capabilities, and low power design.
USB 3.1 Type-C PHY IP, Silicon Proven in TSMC 55ULP
USB3.1Type-C PHY IP is a high performance high speed SERDES IP designed for chips that perform high bandwidth data communication …
USB 3.1 Type-C PHY IP, Silicon Proven in SMIC 14SF+
The USB3.1Type-C PHY is a high-performance, high-speed SERDES IP designed for semiconductors that support low-power, high-bandwid…
USB 2.0 PHY IP, Silicon Proven in TSMC 22ULP
The USB 2.0 PHY IP Core is a full physical layer (PHY) IP solution created for excellent performance and low power consumption.
MIPI D-PHY Rx IP, Silicon Proven in TSMC 28HPC+
The MIPI D-PHY Rx IP Core in 28HPC+ aligns precisely with the D-PHY specification version 1.2, facilitating support for the Displ…
MIPI D-PHY Tx IP, Silicon Proven in TSMC 28HPC+
The MIPI D-PHY Tx IP Core fully complies with version 1.2 of the D-PHY specification.