Single Flow for Interconnecting IP
By Mike Smith and Jo Anderson; Beach Solutions Ltd
June 20, 2008 -- edadesignline.com
The latest challenge facing SoC teams is the construction of a design flow that seamlessly combines:
While, suppliers of Interconnect Matrix components provide complex architectures for hardware, the SoC team is also responsible for producing other associated design view outputs such as documentation and code for software development, test and verification. Ultimately the team is responsible for delivering a fully tested, documented and usable product " on time.
A central Interconnect Matrix allows a designer to create multiple memory maps and control communications paths based on specific master and slave combinations easily and quickly. The design and creation of an Interconnect Matrix component is well defined and tools providing suitable architectures are available, from companies such as Sonics, ARM, Arteris etc.
June 20, 2008 -- edadesignline.com
The latest challenge facing SoC teams is the construction of a design flow that seamlessly combines:
- A complex central Interconnect Matrix
- Auto generation of a diverse range of system design views
While, suppliers of Interconnect Matrix components provide complex architectures for hardware, the SoC team is also responsible for producing other associated design view outputs such as documentation and code for software development, test and verification. Ultimately the team is responsible for delivering a fully tested, documented and usable product " on time.
A central Interconnect Matrix allows a designer to create multiple memory maps and control communications paths based on specific master and slave combinations easily and quickly. The design and creation of an Interconnect Matrix component is well defined and tools providing suitable architectures are available, from companies such as Sonics, ARM, Arteris etc.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Articles
- Design Rights Management of Intellectual Property (IP) Cores in SoPC designs
- Low Power Analysis and Verification of Super Speed Inter-Chip (SSIC) IP
- Perceptual Mapping for Newly Developed 3rd Party IP
- Is Your Processor IP ISO 26262-Compliant?
Latest Articles
- ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs
- ITP-STDP: An Intrinsic-Timing Power-of-Two Learning Engine for On-Chip SNN Training
- OpenEye: A Scalable Open-Source Hardware Accelerator for DNNs
- CHIMERA: A Flexible and Scalable 3.1 TOPS/W AI-MCU with Transformer Accelerator and 563 Gb/s Shared-L2 Memory Subsystem with QoS Guarantees
- CXL-ClusterSim: Modeling CXL-based Disaggregated Memory Cluster for Pooling and Sharing using gem5 and SST