Why is TSMC moving into 450-mm?
Mark LaPedus, EETimes
4/6/2011 3:00 PM EDT
SAN JOSE, Calif. – During the TSMC 2011 Technology Symposium here on Tuesday (April 5), Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) provided more details about its efforts in the 450-mm arena.
As reported, TSMC is moving full speed ahead into the 450-mm fab era. The move is intended to reduce production costs and stay one step ahead of its rivals, such as Globalfoundries, Samsung, UMC and others.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related News
- TSMC 6-inch Wafer Fab Exit Affirms Strategy Shift
- Commentary: Get ready for 450-mm fabs
- Intel, Samsung Electronics and TSMC Reach Agreement for 450mm Wafer Manufacturing Transition
- UMC tips roadmap, questions 450-mm
Latest News
- GF unveils roadmap to deliver the world’s most advanced FD-SOI platform for Physical AI
- GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI
- TSMC September 2026 Revenue Report
- Lattice Collaborates with Arm to Advance Secure, Adaptable AI Data Center Infrastructure
- ZLG Selects CAST CAN XL and TSN IP for Next-Generation Vehicle-Network Development and Test Tools