TSMC gets nod for 130-nm production in China
Mark LaPedus, EETimes
9/30/2010 1:21 PM EDT
SAN JOSE, Calif. - The Taiwan government has approved Taiwan Semiconductor Manufacturing Co. Ltd.'s application to upgrade its 200-mm fab in Shanghai, China to 0.13-micron technology, according to a report from Reuters.
In the past, TSMC was limited to 0.25-micron processes in China by the Taiwan government. Then, the rules were relaxed to 0.18-micron processes in the fab.
Fair or not, the Taiwan government wants to keep leading-edge chip production on the island.
To read the full article, click here
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- TSMC weighs pain versus gain in 130-nm technology
- Faraday Expands Free Library Offerings for UMC's 130nm (0.13-micron) Logic Process
- Nurlogic moves libraries to IBM 130-nm foundry process
- SilTerra to Provide Virage Logic's IPrima(TM) Foundation Platform to Its 130nm Process Customers
Latest News
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility