Foundry model under stress
Mark LaPedus, EE Times
(01/15/2008 6:25 PM EST)
HALF MOON BAY, Calif. — After years of success, the silicon foundry model may be falling apart. Perhaps a better description is that there are growing cracks in the model. In fact, the semiconductor supply chain is headed towards a "collision course," as leading-edge foundries are falling behind Moore's Law and find themselves stretched too thin, according to analysts.
The "collision course" could result in shortages of foundry capacity in the second half of 2008, said Bill McClean, president for IC Insights Inc., at the Industry Strategy Symposium (ISS) here.
(01/15/2008 6:25 PM EST)
HALF MOON BAY, Calif. — After years of success, the silicon foundry model may be falling apart. Perhaps a better description is that there are growing cracks in the model. In fact, the semiconductor supply chain is headed towards a "collision course," as leading-edge foundries are falling behind Moore's Law and find themselves stretched too thin, according to analysts.
The "collision course" could result in shortages of foundry capacity in the second half of 2008, said Bill McClean, president for IC Insights Inc., at the Industry Strategy Symposium (ISS) here.
To read the full article, click here
Related Semiconductor IP
- Verification IP for C-PHY
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
Related News
- Intel Provides Update on Internal Foundry Model
- TSMC Selects Legend's Model Diagnoser for Standard Cell Library Quality Assurance
- HDL Design House announces AT25DF161 VITAL behavioral model
- Carbon Design Systems Adds Co-Simulation Model Library to Expanding System-Level Validation Tool Suite
Latest News
- UMC Reports First Quarter 2026 Results
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility