TSMC Raises The Semiconductor Bar With 450mm!
February 7, 2011
During the most recent conference call, TSMC not only beat revised estimates and announced record spending levels for 2011, Morris Chang also officially announced that a 450mm fab (Fab 12 Phase VI) is currently in the planning stages with target production @ 20nm in 2015. This is HUGE!
According to Morris Chang:
To read the full article, click here
Related Semiconductor IP
- SpaceWire Node IP core
- nQrux Secure Boot
- 4K/8K Multiformat IP supporting AV2 decoder
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
Related Blogs
- TSMC on 450mm transition: Lithography key!
- Is 450mm A Dead Duck?
- The Riddle Of 450mm
- What's happening on the 450mm wafer front?
Latest Blogs
- A Repeatable Framework for Hardware Security Assurance
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA