TSMC on 450mm transition: Lithography key!
October 4, 2012
TSMC unveiled its schedule for 450mm mass production at the recently held SEMICON Taiwan 2012 450mm Supply Chain Forum. Focusing on lithography as the key, Dr. C.S. Yoo, senior director of the 450mm program at TSMC, noted that IC makers and equipment suppliers should fully leverage the G450C. They need to work and innovate to make the 450mm transition a great success.
TSMC has always been in the relentless pursuit of technology innovation. It has been part of all of the computing waves that have driven the market growth. Right now, mobile computing is the leading market driver. TSMC has been helping the industry produce comprehensive, powerful mobile computing devices.
To read the full article, click here
Related Semiconductor IP
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 12nm FFC
- Ultra-Low Latency 32Gbps SerDes IP in TSMC 22nm ULP
- 32Gbps SerDes IP in TSMC 12nm FFC
- 32Gbps SerDes IP in TSMC 22nm ULP
- MIPI D-PHY and FPD-Link (LVDS) Combinational Transmitter for TSMC 22nm ULP
Related Blogs
- Design impact of 450mm transition
- Is 450mm A Dead Duck?
- The Riddle Of 450mm
- What's happening on the 450mm wafer front?
Latest Blogs
- A Repeatable Framework for Hardware Security Assurance
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA