The Riddle Of 450mm
May 10, 2010
The whole 450mm wafer thing is a puzzle. Last week at IEF 2010, there was TSMC's CTO Jack Sun, saying he wanted and expected 450mm to happen while, listening to him in the audience, was Heinz Kundert, European CEO of SEMI whose members make the chip manufacturing equipment, who said later: "We don't want it."
To read the full article, click here
Related Semiconductor IP
- I3C Full Controller / Target
- I3C HCI Host Controller
- USB-C Power Delivery IP Core
- Configurable Multi-Channel DMA Controller
- Samsung Foundry 4nm 1V8 GPIO I3C
Related Blogs
- What's happening on the 450mm wafer front?
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
Latest Blogs
- TDISP and Confidential Computing: Extending the PCIe Chain of Trust
- AI-Generated UVM Testbenches from SoC Specifications
- Generating Chip Subsystems Automatically: A New Answer to Manage Chip Design Complexity
- Agentic AI Should Fit the Way You Engineer
- Listening at the Speed of Memory: Live Speech Recognition on Chimera