The Riddle Of 450mm
May 10, 2010
The whole 450mm wafer thing is a puzzle. Last week at IEF 2010, there was TSMC's CTO Jack Sun, saying he wanted and expected 450mm to happen while, listening to him in the audience, was Heinz Kundert, European CEO of SEMI whose members make the chip manufacturing equipment, who said later: "We don't want it."
To read the full article, click here
Related Semiconductor IP
- nQrux Secure Boot
- 4K/8K Multiformat IP supporting AV2 decoder
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
Related Blogs
- What's happening on the 450mm wafer front?
- How Much Cost Reduction Will 450mm Wafers Provide
- Why do we need 450mm wafers?
- The State of 450mm Wafers. And Intel Gossip
Latest Blogs
- A Repeatable Framework for Hardware Security Assurance
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA