Together, we are building the future of computing, on Arm
September 18, 2023
Today in New York and Arm sites worldwide, we are celebrating our re-entrance into the public markets and our next phase in building the future of computing.
To the Arm employees, partners and the entire ecosystem who have worked together to advance the Arm computing platform over our 33-year history, a heartfelt thank you.
Together, we have built the world’s largest compute and software ecosystem based on the most pervasive CPU architecture in history. More than 250 billion Arm-based chips have shipped to date, making Arm CPUs the brains of everything. This shared success stems from the Arm DNA, born of designing high-performance, yet power-efficient processors for products that run off batteries.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Blogs
- Building Smarter, Faster: How Arm Compute Subsystems Accelerate the Future of Chip Design
- Windows on Arm is Ready for Prime Time: Native Chrome Caps Momentum for the Future of Laptop Computing
- Small Language Models: Efficient Arm Computing Enables a Custom AI Future
- Deep Robotics and Arm Power the Future of Autonomous Mobility
Latest Blogs
- Embedded Security explained: Advanced Encryption Standard (AES)
- Cadence Demonstrates PCIe 8.0 PHY at PCI-SIG DevCon 2026
- Cadence Achieves Successful Silicon Validation of 1st IP Test Chips on Intel 18A
- From Classical CAN and CAN FD to CAN XL: Functional Safety and Security for Next-Generation In-Vehicle Communication
- Accelerating Embedded Memory Performance with 16-bit xSPI PSRAM IP