Mobile World Congress: Two New Audio IP Announcements
BARCELONA, Spain—Mobile World Congress is not surprisingly focused on mobile devices, applications, and services. And the Cadence Tensilica team, which has been attending this event for a decade, generally has something up its sleeves when the booth opens for business each year.
This time was no exception. The company announced that DTS’s Headphone:X immersive sound technology has been optimized for the Cadence Tensilica HiFi Audio/Voice DSPs and, separately, that Waves MaxxVoice technology has been ported to and optimized for HiFi.
To read the full article, click here
Related Semiconductor IP
- Tensilica ConnX 120 DSP
- Tensilica DSP IP supports efficient AI/ML processing
- Tensilica Xtensa NX Processor Platform
- Tensilica Xtensa LX Processor Platform
- Tensilica FloatingPoint KQ7/KQ8 DSPs
Related Blogs
- Android Audio Offload Explained at Mobile World Congress
- GlobalFoundries and the Mobile World Congress
- Mobile World Congress: A Decade of Change in IP Innovation
- Mobile World Congress show report - 8 things we learned
Latest Blogs
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA
- Beyond PCIe Compliance: Why Stress Testing Is Crucial for Edge AI Deployments