Mobile World Congress: Two New Audio IP Announcements
March 17, 2015
BARCELONA, Spain—Mobile World Congress is not surprisingly focused on mobile devices, applications, and services. And the Cadence Tensilica team, which has been attending this event for a decade, generally has something up its sleeves when the booth opens for business each year.
This time was no exception. The company announced that DTS’s Headphone:X immersive sound technology has been optimized for the Cadence Tensilica HiFi Audio/Voice DSPs and, separately, that Waves MaxxVoice technology has been ported to and optimized for HiFi.
To read the full article, click here
Related Semiconductor IP
- Tensilica DSP IP supports efficient AI/ML processing
- Tensilica FloatingPoint KQ7/KQ8 DSPs
- Tensilica FloatingPoint KP1/KP6 DSPs
- Tensilica AI Max - NNA 110 Single Core
- Compact neural network engine offering scalable performance (32, 64, or 128 MACs) at very low energy footprints
Related Blogs
- Android Audio Offload Explained at Mobile World Congress
- GlobalFoundries and the Mobile World Congress
- Mobile World Congress: A Decade of Change in IP Innovation
- Mobile World Congress show report - 8 things we learned
Latest Blogs
- Automated, Faster Specification to Sign-Off with IDS-AI
- NovaTech Automation Crius PIU: Bringing Conventional Instrument Transformers onto the IEC 61850 Process Bus
- Single Pair Ethernet and TSN: The In-Robot Network Behind the Next Humanoid Robots
- A design path to success exists for ultra-low-voltage SoCs
- Where Routine Flow Ends Veriest Formal Expertise Begins