Mobile World Congress: A Decade of Change in IP Innovation
BARCELONA, Spain—In the past decade, immense change has come to mobile electronic system design. Steve Roddy should know. He’s had a ringside seat to those changes—and Mobile World Congress—for years.
Roddy, senior group director for Tensilica marketing, said during MWC 2015 that system design is a much different challenge than it was a decade ago. (Tensilica, which Cadence acquired in 2013, has exhibited at big events like MWC and Consumer Electronics Show for years).
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Blogs
- Andes Technology: A RISC-V Powerhouse Driving Innovation in CPU IP
- World IP Day: A Time to Reflect on the Value of Semiconductor IP
- SiFive; Empowering A New Era of Data Center Innovation
- Silicon-proven LVTS for 2nm: a new era of accuracy and integration in thermal monitoring
Latest Blogs
- AI in Design Verification: Where It Works and Where It Doesn’t
- PCIe 7.0 fundamentals: Baseline ordering rules
- Ensuring reliability in Advanced IC design
- A Closer Look at proteanTecs Health and Performance Management Solutions Portfolio
- Enabling Memory Choice for Modern AI Systems: Tenstorrent and Rambus Deliver Flexible, Power-Efficient Solutions