Vendor: Cadence Design Systems, Inc. Category: DSP Core

Tensilica DSP IP supports efficient AI/ML processing

The Cadence AI IP platform includes the extensible DSP platform from Cadence, which provides flexible instruction sets designed t…

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Overview

The Cadence AI IP platform includes the extensible DSP platform from Cadence, which provides flexible instruction sets designed to perform artificial intelligence and machine learning (AI/ML) workload operations efficiently. Mixing AI and DSP workloads in a single application is easy with Tensilica DSPs.

The Tensilica AI Base platform offers 8 GOPS to up to 2 TOPS of AI performance and includes the popular Tensilica HiFi DSPs for audio/voice, Vision DSPs, and ConnX DSPs for radar and communications. The DSPs are based on the VLIW and SIMD architectures, with instruction sets optimized for specific domains, including extensions for AI. Customers benefit from the domain-specificity, extensibility, and configurability they have come to expect from the trusted, mature Tensilica DSP architecture. SoC designers can extend the base architecture to address specific workload requirements and create differentiation. These DSPs also offer a scalable multiplier accumulator (MAC) block that can run custom AI workloads efficiently, as well as an optimized NN library and comprehensive software support.

Key features

  • Powerful DSP Instruction Set Supporting AI/ML Operations.
    • Highly scalable IP portfolio, with AI Base built on successful and power-efficient domain-specific DSPs.
  • Mixed Workloads.
    • AI/ML processing can seamlessly combine with DSP in a unified application.
  • Industry-Leading Performance and Power Efficiency.
    • High Inferences per second per area (IPS/mm2) and per power (IPS/W).
  • End-to-End Software Toolchain for All Markets and a Large Number of Frameworks.
    • NeuroWeave SDK provides a common tool for compiling networks across IP, with flexibility for performance, accuracy, and run-time environments.

What’s Included?

  • Free Software Evaluation
    • Try our SDK Software Development Toolkit for 15 days absolutely free. We want to show you how easy it is to use our Eclipse-based IDE.
  • Online Support:
    • The Cadence Online Support (COS) system fields our entire library of accessible materials for self-study and step-by-step instruction.
  • Xtensa Processor Generator (XPG):
    • The Xtensa Processor Generator (XPG) is the heart of our technology - the patented cloud-based system that creates your correct-by-construction processor and all associated software, models, etc. (Login Required)
  • Technical Forum Access:
    • Find community on the technical forums to discuss and elaborate on your design ideas.

Specifications

Identity

Part Number
Tensilica AI Base
Vendor
Cadence Design Systems, Inc.
Type
Silicon IP

Files

Product Sheet Download

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Provider

Contact Cadence Design Systems, Inc.

Learn more about DSP Core IP core

Role of Time-of-Flight Sensors in Automotive

The automotive sector is undergoing a profound transformation, moving beyond basic detection to a comprehensive, real-time 3D understanding of both the external environment and the vehicle's interior. ToF is emerging as a pivotal technology, offering precise 3D depth and distance information essential for navigating complex environments and understanding in-cabin dynamics.

Building a high-performance, low-power audio/voice subsystem

With the growing popularity of applications such as mobile gaming and voice triggering, the audio/voice subsystem is playing a prominent role in many mobile system-on-chip (SoC) designs. The subsystem must be designed to meet dual demands: high-performance, high-resolution audio stream processing as well as always-on, low-power voice trigger and recognition. Customizable digital signal processing (DSP) and audio/voice subsystem solution intellectual property (IP) blocks can provide a cost-effective and efficient way to develop and deliver high-performance audio/voice products.

Frequently asked questions about DSP Core IP cores

What is Tensilica DSP IP supports efficient AI/ML processing?

Tensilica DSP IP supports efficient AI/ML processing is a DSP Core IP core from Cadence Design Systems, Inc. listed on Semi IP Hub.

How should engineers evaluate this DSP Core?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this DSP Core IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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