Common Platform: Onward to the Future
March 15, 2012
There were keynotes from all three semiconductor partners in the Common Platform Alliance and, as if to show how common they are, they all talked about the problems that need to be addressed in the next decade and a half and they all said pretty much the same thing. Gary Patton of IBM went first and so he got to say everything first. Plus, it is clear, IBM does all the early research before technologies reach the point at which cooperative development can begin.
To read the full article, click here
Related Semiconductor IP
- NPU IP
- JPEG XL Encoder
- I2C Master/Slave Controller Core
- NVMe Validation Test Suite
- Hybrid Memory Cube Verification IP
Related Blogs
- Is the Common Platform Alliance a credible competitor to TSMC?
- TSMC Open Innovation Platform Explained
- TSMC Extends Open Innovation Platform
- Plunify launches SaaS platform that integrates FPGA design tools
Latest Blogs
- Tape-Out Readiness Checklist: Engineering Decisions That Prevent Costly Respins
- How Cadence DSPs Put In-Cabin AI Audio On-Chip in SemiDrive's X10
- The Fastest Path to Scalable Photonic Systems: Using Proven IP for both PIC and EIC designs
- Building Trusted AI Agents from the Silicon Root of Trust
- Heterogeneous Computing in Space