Is the Common Platform Alliance a credible competitor to TSMC?
Last week, the Common Platform Alliance—consisting of IBM, Samsung, and GLOBALFOUNDRIES—held a Technology Forum at the Santa Clara Convention Center (SVCC) to discuss its 32/28nm process nodes now going into production (the 28nm node is mostly a straight shrink of the 32nm process node), the 20nm process node, and future plans for more advanced semiconductor-processing nodes. The keynotes and initial panel discussion took place in the SVCC’s 22,400-square-foot ballroom, which can hold as many as 3199 people when set up in a theater arrangement. I didn’t see 3000 people in the room, but it was clearly more than 1000 and it certainly felt like more than 1000 in the lunch queue. The place was packed. The keynotes were pretty darn good. It all put the Common Platform Alliance in a very professional light.
To read the full article, click here
Related Semiconductor IP
- Ultra Ethernet MAC & PCS 100G/200G/400G/800G
- Ethernet PCS 100G/200G/400G/800G/1.6T
- Ethernet MAC 100G/200G/400G/800G/1.6T
- Junction Over-Temperature Detector with Linear Centigrade-to-Voltage Output - X-FAB XT018
- Performance P570 Gen 3
Related Blogs
- Common Platform: Onward to the Future
- When a Platform Provider Becomes a Competitor: Why Arm’s Silicon Strategy Changes the Incentives
- Next-Generation DDR4 and LPDDR4 IP in TSMC 16FF+ Enable 200Gb+ Data Transfers for Mobile, Cloud, and IoT Platforms
- TSMC Open Innovation Platform Explained
Latest Blogs
- Inside the SiFive Performance™ P570 Gen 3: High Performance Efficiency for Next-Generation Consumer and Commercial Applications
- What the steam engine can teach us about modern chip design
- Automotive silicon in the era of AI, functional safety, and cybersecurity
- JPEG XS Officially Joins GenICam, The Machine Vision Standard Managed By EMVA
- Beyond PCIe Compliance: Why Stress Testing Is Crucial for Edge AI Deployments