SAMSUNG 28nm FDSOI USB2.0 Dual Role PHY/OTG PHY
The USB 2.0 OTG PHY is a Hi-Speed USB peripheral transceiver IP that implements the Intel® UTMI standard.
- USB 2.0
- Samsung
- 28nm
- FDS
- Pre-Silicon
Single-Protocol PHY IP cores help engineering teams evaluate reusable semiconductor IP for advanced chip designs.
This page lets you compare Single-Protocol PHY IP offerings from multiple vendors based on functionality, integration requirements, performance targets, power efficiency, and process compatibility.
SAMSUNG 28nm FDSOI USB2.0 Dual Role PHY/OTG PHY
The USB 2.0 OTG PHY is a Hi-Speed USB peripheral transceiver IP that implements the Intel® UTMI standard.
GLOBALFOUNDRIES 28nm USB2.0 Dual Role PHY/OTG PHY
The USB 2.0 OTG PHY is a Hi-Speed USB peripheral transceiver IP that implements the Intel® UTMI standard.
GLOBALFOUNDRIES 55nm USB2.0 Dual Role PHY
The USB 2.0 dual role PHY is a Hi-Speed USB peripheral transceiver IP that implements the Intel® UTMI standard.
GLOBALFOUNDRIES 0.13um USB2.0 Dual Role PHY
The USB 2.0 dual role PHY is a Hi-Speed USB peripheral transceiver IP that implements the Intel® UTMI standard.
GLOBALFOUNDRIES 0.11um USB2.0 Dual Role PHY
The USB 2.0 dual role PHY is a Hi-Speed USB peripheral transceiver IP that implements the Intel® UTMI standard.
The sub-LVDS Receiver IP is designed as an interface to bridge Video Image Sensors and processors.
The sub-LVDS Receiver IP is designed as an interface to bridge Video Image Sensors and processors.
GLOBALFOUNDRIES 28nm SLP sub-LVDS Receiver
The sub-LVDS Receiver IP is designed as an interface to bridge Video Image Sensors and processors.
GLOBALFOUNDRIES 65nm LVDS Transmitter
The LVDS transmitter is designed to support Single Link transmission between Host and Flat Panel Display with up to SXGA+ resolut…
USB 3.1 Gen.1 TYPE-C PHY ; UMC 40nm Logic/Mixed-Mode Low Power/RVT+LVT Process
USB 3.1 Gen.1 TYPE-C PHY ; UMC 40nm Logic/Mixed-Mode Low Power/RVT+LVT Process
Two Port OTG USB2.0 PHY;BOAC version; Wire bonding;UMC 40 nm LP/RVT process.
Two Port OTG USB2.0 PHY;BOAC version; Wire bonding;UMC 40 nm LP/RVT process.
USB 2.0 On-The-Go PHY; UMC 28nm HPC RVT Logic Process
USB 2.0 On-The-Go PHY; UMC 28nm HPC RVT Logic Process
USB 1.1 transceiver support crystal-less mode in USB system ; UMC 55nm eFlash Process
USB 1.1 transceiver support crystal-less mode in USB system ; UMC 55nm eFlash Process
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 55nm Logic Low Power Low-K Process
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 55nm Logic Low Power Low-K Process
USB1.1 PHY Feature USB 1.1 On-The-Go PHY; UMC 0.11um HS/AE (AL Enhancement) Logic Process, without internal power clamping circuit
3.3V LVDS Transmitter 16~100MHz; 55nm SP/RVT LowK Logic Process
3.3V LVDS Transmitter 16~100MHz; 55nm SP/RVT LowK Logic Process
2.5V LVDS Transmitter 1.25Gbps; UMC 40nm LP LowK Logic Process.
2.5V LVDS Transmitter 1.25Gbps; UMC 40nm LP LowK Logic Process.
3.3V LVDS Transmitter 700Mbps; UMC 40nm LP LowK Logic Process
3.3V LVDS Transmitter 700Mbps; UMC 40nm LP LowK Logic Process
3.3V FPD-link LVDS Transmitter 16~100MHz; UMC 28nm HPC process
3.3V FPD-link LVDS Transmitter 16~100MHz; UMC 28nm HPC process
2.5V FPD-link LVDS Transmitter 16~178.6MHz; UMC 40nm LP Low-K process
2.5V FPD-link LVDS Transmitter 16~178.6MHz; UMC 40nm LP Low-K process