Scaling the 100 GbE Memory Wall
Michael Sporer, Director of IC Marketing, MoSys
4/14/2014 10:15 AM EDT
All interrelated system-level tradeoffs, including performance, pin count, and area, ultimately are driven by power consumption considerations. At 100 and 400 GbE, network chip vendors must consider end-to-end solutions for equipment OEMs. To remain competitive, OEMs plan to introduce multi-terabit systems that aggregate multiple 100 Gbit/s ports on each line card.
Two current technology trends, 100 Gbit/s line speeds in network appliances and the transition to IPv6, compound design complexity. At both the network SOC and OEM appliance levels, solutions have to deliver performance, network management, and quality of service. Crucial parameters include absolute delay, delay jitter, minimum delivered bandwidth, and packet loss.[1] Network engineers monitor and manage networks based on these parameters, which also serve as the basis of contractual service-level agreements.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Articles
- Pushing the Memory Bandwidth Wall with CXL-enabled Idle I/O Bandwidth Harvesting
- Combating the Memory Walls: Optimization Pathways for Long-Context Agentic LLM Inference
- The benefit of non-volatile memory (NVM) for edge AI
- Understanding the contenders for the Flash memory crown
Latest Articles
- SCENIC: Stream Computation-Enhanced SmartNIC
- Agentic AI-based Coverage Closure for Formal Verification
- Microarchitectural Co-Optimization for Sustained Throughput of RISC-V Multi-Lane Chaining Vector Processors
- RISC-V Functional Safety for Autonomous Automotive Systems: An Analytical Framework and Research Roadmap for ML-Assisted Certification
- Emulation-based System-on-Chip Security Verification: Challenges and Opportunities