Reliability challenges in 3D IC semiconductor design
By John Ferguson - Director of Product Management, Siemens DIS
EETimes (November 28, 2023)
3D ICs represent an expansion of heterogeneous advanced package technology into the third dimension, presenting similar design to manufacturability challenges as 2D advanced packages along with additional complexities. While not yet widespread, the advent of chiplet standardization initiatives and the development of supporting tools are making 3D ICs more feasible and profitable for a broader range of players, including both large and small companies with smaller production runs.
The implementation of 3D ICs allows companies to divide a design into functional subcomponents and integrate the resulting IP at the most suitable process nodes. This facilitates low latency, high bandwidth data movement, reduced manufacturing costs, increased wafer yields, lower power consumption, and overall decreased expenses. These appealing advantages are driving significant growth and progress in advanced heterogeneous packaging and 3D IC technologies.
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related Articles
- Emerging Trends and Challenges in Embedded System Design
- Integrating VESA DSC and MIPI DSI in a System-on-Chip (SoC): Addressing Design Challenges and Leveraging Arasan IP Portfolio
- It's Just a Jump to the Left, Right? Shift Left in IC Design Enablement
- Bigger Chips, More IPs, and Mounting Challenges in Addressing the Growing Complexity of SoC Design
Latest Articles
- LACE: Large Language Model Aided Multi-Agent Framework for Agile RISC-V Instruction Extension
- A Process-Aware Hybrid Si/IGO Monolithic-3D 6T SRAM with BEOL Pass-Gates for the 2nm Node
- Automated Estimation of MBIST Area and Test Time in Heterogeneous Memory IPs via Stacked Ensemble Framework
- VIPER: Architecture-Aware Performance Modeling for Processing-in-Memory Design-Space Exploration
- CTTE: An Open Dual-Protocol RISC-V Trace Encoder for N-Trace and E-Trace