ESD and EMI hazards in mobile phones--Solutions for the audio system connector
By Richard Renard, STMicroelectronics
(06/15/08, 12:35:00 PM EDT)
Modern materials and technology produce electro-static discharge (ESD) and electro-magnetic interference (EMI) as ever-present hazards. What we wear and what we touch create potential for ESD. Digital technology has added to the EMI hazard always present in any electrical device. ESD can destroy electronic components in mobile phones. The mobile phone can be easily replaced but the disruption to the user can be significant. Circuit designers need to ensure that they employ measures to suppress the potentially damaging effect of ESD.
EMI presents itself in audio circuits as hisses, crackles, buzzes and generally poor sound quality. Users will not tolerate such disturbances in what they expect to be a quality communications device. So, EMI disturbances must be filtered out of the audio circuits.
To read the full article, click here
Related Semiconductor IP
- Chiplet Die-to-Die Interconnect IP Solution
- High speed MACsec Engine 100G/200G/400G/800G/1.6T
- Temperature/Voltage sensors
- AMBA Bus Host to eSPI Controller/Target
- AMBA Bus Host to eSPI Controller
Related Articles
- Choosing a mobile-storage interface: eMMC or UFS
- Mobile Devices: RISC-Java blend powers cores
- Speakers cite trouble spots for SoC, mobile designs
- Testable SoCs : Every new design is an ESD test chip
Latest Articles
- ZK-Flex: A Flexible and Scalable Framework for Accelerating Zero-Knowledge Proofs
- ITP-STDP: An Intrinsic-Timing Power-of-Two Learning Engine for On-Chip SNN Training
- OpenEye: A Scalable Open-Source Hardware Accelerator for DNNs
- CHIMERA: A Flexible and Scalable 3.1 TOPS/W AI-MCU with Transformer Accelerator and 563 Gb/s Shared-L2 Memory Subsystem with QoS Guarantees
- CXL-ClusterSim: Modeling CXL-based Disaggregated Memory Cluster for Pooling and Sharing using gem5 and SST