ESD and EMI hazards in mobile phones--Solutions for the audio system connector
By Richard Renard, STMicroelectronics
(06/15/08, 12:35:00 PM EDT)
Modern materials and technology produce electro-static discharge (ESD) and electro-magnetic interference (EMI) as ever-present hazards. What we wear and what we touch create potential for ESD. Digital technology has added to the EMI hazard always present in any electrical device. ESD can destroy electronic components in mobile phones. The mobile phone can be easily replaced but the disruption to the user can be significant. Circuit designers need to ensure that they employ measures to suppress the potentially damaging effect of ESD.
EMI presents itself in audio circuits as hisses, crackles, buzzes and generally poor sound quality. Users will not tolerate such disturbances in what they expect to be a quality communications device. So, EMI disturbances must be filtered out of the audio circuits.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related Articles
- Choosing a mobile-storage interface: eMMC or UFS
- Mobile Devices: RISC-Java blend powers cores
- Speakers cite trouble spots for SoC, mobile designs
- Testable SoCs : Every new design is an ESD test chip
Latest Articles
- SCENIC: Stream Computation-Enhanced SmartNIC
- Agentic AI-based Coverage Closure for Formal Verification
- Microarchitectural Co-Optimization for Sustained Throughput of RISC-V Multi-Lane Chaining Vector Processors
- RISC-V Functional Safety for Autonomous Automotive Systems: An Analytical Framework and Research Roadmap for ML-Assisted Certification
- Emulation-based System-on-Chip Security Verification: Challenges and Opportunities