Texas Instruments opens the company's first semiconductor manufacturing plant in China
Chengdu fab puts manufacturing close to growing customer base in China
CHENGDU, China, Oct. 14, 2010 -- Texas Instruments Incorporated (NYSE: TXN) (TI) today announced its first wafer fabrication facility, or "fab," in China. This important milestone puts manufacturing close to the company's growing customer base there. Located in the Chengdu High-tech Zone (CDHT), which is considered by many to be China's next major technology hub, TI Chengdu will further expand TI's analog production capacity.
The fab is a fully equipped 200mm manufacturing facility and was purchased from Cension Semiconductor Manufacturing Company. It includes an operating 120,000-square- foot fab that can support more than $1 billion in annual revenue and a 134,000-square-foot fab reserved for future production needs.
"TI has been committed to serving the China market for 25 years," said Gregg Lowe, TI senior vice president for Analog. "Increasingly, customers there are using TI's analog chips for the real-world functions in their electronic applications. This fab in Chengdu will strengthen our ability to support customers' growing requirements and deliver analog products when and where customers need them."
This announcement follows TI manufacturing expansions in the U.S., Japan and Germany over the past 24 months.
For more information about TI delivery capacity and analog manufacturing investments, please see www.ti.com/chengdu-pr.
About Texas Instruments
Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.
Related Semiconductor IP
- Dual Channel 8b D/A Converter - TSMC T40ULP
- Dual Channel 12b D/A Converter - TSMC T40ULP+ESF3
- 8bit D/A Converter - TSMC 22nm ULP
- 12bit 2MSps A/D Converter - TSMC T22ULP
- TSMC 2nm 1V2 GPIO
Related News
- Huawei planning on using SMIC to fab 7nm ICs this year
- Palm to base next-generation wireless units on TI platform
- TI wraps DSP/RISC combo with RTOS support
- TI offers video extensions, software for rapid DSP development
Latest News
- Perceptia Releases Design Kit for pPLL03 on Samsung Foundry 14LPU Platform
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer