Huawei planning on using SMIC to fab 7nm ICs this year
By David Manners, Electronics Weekly (July 31, 2023)
Huawei plans to fab 5G chips on a 7nm process at SMIC this year, reports the Nikkei.
The chips are not expected to be in phones on the market until next year.
To read the full article, click here
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Huawei Mate 60 Pro processor made on SMIC 7nm N+2 process
- Huawei Launches Kirin 980, the World's First Commercial 7nm SoC
- Apple, Huawei Use TSMC, But Their 7nm SoCs Are Different
- SMIC Graduating from 14nm to Something Sort of Akin to 7nm
Latest News
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.
- RF Front-End Modules & Components IP Trends – Q1 2026 Monitoring Release