Samsung, Toshiba Detail AI Chips
ISSCC papers target smartphones, cars
February 20, 2019
SAN FRANCISCO — Samsung described a new neural network accelerator for smartphones that matches blocks from rivals such as Huawei. Toshiba detailed one for self-driving cars that pulls ahead of competitors such as Intel’s Mobileye at the International Solid-State Circuits Conference here.
A 5.5mm2 block in the latest 8nm Exynos chip delivers 1.9 Tera-operations/second using 8-bot precision running at up to 933 MHz, said Jinook Song, a Samsung AI engineer. That’s about the rating for the latest Kirin processor in Huawei phones and the latest commercial IP blocks.
To read the full article, click here
Related Semiconductor IP
- RISC-V-Based, Open Source AI Accelerator for the Edge
- AI SDK for Ceva-NeuPro NPUs
- AI Processor Accelerator
- Tessent AI IC debug and optimization
- CPU core for demanding AI
Related News
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
- Semidynamics Secures a Strategic Investment to Advance Memory-Centric AI Inference Chips
- FotoNation and SEMIFIVE Announce Strategic Collaboration for Turnkey Development of TriSilica Perceptual AI Chip Family Using Samsung Foundry
Latest News
- Silvaco Announces Partnership with Dassault Systèmes to Advance First-Time-Right Semiconductor Manufacturing
- Socionext Broadens SoC Roadmap with Intel 18A-P Process Technology
- BrainChip and Neuromorphyx Announce an AKD1500 Embedded Developer Board, Bringing Neuromorphic AI to the Embedded Engineering Community
- M31 Reports Nearly Fourfold Growth in Advanced-Node Royalties as Long-Term Investments Begin to Bear Fruit
- Andes Technology’s D23-SE RISC-V Processor Achieves ISO 26262 ASIL‑B and ASIL‑D Certification for Functional Safety Applications