Samsung Slows Opening of Texas Fab Despite CHIPS Stimulus
By Alan Patterson, EETimes (July 16, 2024)
Samsung has slowed the ramp of its new fab in Taylor, Texas, despite the Department of Commerce (DoC) conditionally awarding the company a $6.6 billion stimulus package under the CHIPS Act. The DoC told EE Times that the subsidies for Samsung and other CHIPS Act winners are not final yet.
On April 15, the DoC and Samsung signed a non-binding agreement providing up to $6.4 billion in direct funding under the CHIPS Act to help revive chipmaking in the U.S. During a quarterly results announcement on April 30, Samsung said that it delayed the production start for the Taylor fab project from the second half of 2024 to “maybe 2026.”
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- Samsung Selects Texas as Site for $17 Billion Fab
- Chiplet Interconnect Pioneer Eliyan Closes $60 Million Series B Funding Round, Co-led by Samsung Catalyst Fund and Tiger Global Management to Address Most Pressing Challenge in Development of Generative AI Chips
- TSMC Arizona and U.S. Department of Commerce Announce up to US$6.6 Billion in Proposed CHIPS Act Direct Funding, the Company Plans Third Leading-Edge Fab in Phoenix
- SkyWater to Acquire Infineon’s Austin Fab and Establish Strategic Partnership to Expand U.S. Foundry Capacity for Foundational Chips
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers