GUC Collaborate with Wiwynn to Advance Silicon-to-System Infrastructure for Next-Generation Hyperscale AI

Collaboration brings together flagship SoC design, optical I/O and rack-scale liquid-cooled system integration to help hyperscalers accelerate system-ready AI infrastructure

HSINCHU, TAIWAN – May 4, 2026 – Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.

AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure.

“As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical,” said Aditya Raina, Chief of Marketing of GUC. “By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure.

“With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment,” said Tony Wen, Vice President at Wiwynn. “Together with GUC, we are enabling a comprehensive silicon-to-system approach that delivers scalable, efficient and serviceable AI infrastructure tailored for next-generation hyperscale environments.”

About GUC

GLOBAL UNICHIP CORP. (GUC) is the Advanced ASIC Leader who provides the semiconductor industry with leading IC implementation and SoC manufacturing services, using advanced process and packaging technology. Based in Hsin-Chu, Taiwan, GUC has developed a global reputation with a presence in North America, Europe, Japan, Korea, China, and Vietnam. GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443.

For more information, please visit our website: www.guc-asic.com

About Wiwynn

Wiwynn is an innovative cloud IT infrastructure provider delivering high-quality computing, storage, and rack-level solutions for leading data centers worldwide. Guided by the vision to "unleash the power of digitalization; ignite the innovation of sustainability," Wiwynn actively invests in next-generation technologies to deliver the best TCO, workload- and energy optimized IT solutions from cloud to edge. Wiwynn's end-to-end capabilities span server design, system integration, and high-volume L10/L11 rack delivery, backed by a manufacturing network spanning Taiwan, the United States, Mexico, Malaysia, and the Czech Republic.

For more information, visit www.wiwynn.com