Vendor: Nuclei System Technology Category: Edge AI Accelerator

AI DSA Processor - 9-Stage Pipeline, Dual-issue

NI900 is a DSA processor based on 900 Series.

Overview

NI900 is a DSA processor based on 900 Series. NI900 is optimized with features specifically targeting AI applications.

Key features

  • Base Processor:
    Can be configured into any RV32 or RV64 processor ---N900/U900/NX900/UX900.
  • RVV1.0 VPU:
    Support VPU based on RISC-V V Extension (RVV1.0 Vector ISA), with 512-bit to 1024-bit VLEN configurable.
    • Lite-VPU: VPU can be configured to Lite-VPU, supporting frequently used embedded AI vector instructions and data types to save VPU area.
    • Shared VPU across Multiple Cores: Multiple cores within one cluster can share one VPU while keeping software consistent in a SMP architecture to save area.
  • NPU Accelerator:
    Can be tightly coupled with CPU through NI900's IOCP(IO Coherent Port) to maintain cache coherence with CPU.
  • User Defined Instruction Interface:
    Users can add customized scalar/vector instructions through Nuclei NICE interface, maintaining coherency with main CPU core.

Block Diagram

Specifications

Identity

Part Number
NI900
Vendor
Nuclei System Technology
Type
Silicon IP

Files

Note: some files may require an NDA depending on provider policy.

Provider

Learn more about Edge AI Accelerator IP core

Frequently asked questions about Edge AI Accelerator IP cores

What is AI DSA Processor - 9-Stage Pipeline, Dual-issue?

AI DSA Processor - 9-Stage Pipeline, Dual-issue is a Edge AI Accelerator IP core from Nuclei System Technology listed on Semi IP Hub.

How should engineers evaluate this Edge AI Accelerator?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Edge AI Accelerator IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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