Has Samsung Snagged Qualcomm Business with New Process?
Alan Patterson, EETimes
1/15/2016 06:35 PM EST
TAIPEI — Samsung Electronics, which has been in a nip-and-tuck race with Taiwan Semiconductor Manufacturing Co. (TSMC) to win foundry orders with the world’s most advanced fabrication technology, may have grabbed all of Qualcomm’s business with a second-generation version of its 14nm FinFET process.
Samsung has launched commercial production of advanced logic using its 14nm Low-Power Plus (LPP) process, the latest generation of the 14nm process technology, the company said in a press statement.
Qualcomm, which accounted for about 20 percent of TSMC’s orders two years ago, has moved most of its business to Samsung at 10/14nm for 2017 and beyond, according to Warren Lau, an analyst with Maybank Kim Eng in Hong Kong.
To read the full article, click here
Related Semiconductor IP
- CXL Controller With HPC Features (Spec Version 3.0 and Above)
- AP Memory VHM Controller
- High-performance, commercial-grade RISC-V CPU Core IP
- SWI3S Verification IP
- Secure Boot Loader
Related News
- Synopsys' Custom Compiler Enabled for Samsung Foundry's 14-nm FinFET Process
- SJSemi and Qualcomm Jointly Announce Mass Production of 14nm Wafer Bumping Technology
- INVECAS and GLOBALFOUNDRIES Announce Availability of Advanced 14nm FinFET Design IP Library for High-Performance Computing, Networking, and High-End Mobile Applications
- GLOBALFOUNDRIES Demonstrates Industry-Leading 56Gbps Long-Reach SerDes on Advanced 14nm FinFET Process Technology
Latest News
- Brite Semiconductor Releases 28nm High-Performance SAR ADC IP, Driving Upgrades for High-Speed Signal Chain Applications
- Synopsys Updates CXL IP Portfolio for AI-Era Infrastructure
- BrainChip Launches Symphony Community Akida Bundle For IBM’s Workload Management Solution
- StarIC Appoints Dr. Masum Hossain as Chief Technology Officer
- Andes Technology Empowers RISC-V Developers with Its New Streamlined IDE, RVBuilder