mimoOn claims market leadership in LTE PHY software on SDR silicon for mobile terminals
Duisburg, Germany – September 15, 2010: mimoOn GmbH, the LTE software for Software Defined Radio (SDR) company, has won a further licensing deal for mi!MobilePHY™ Physical Layer (PHY) software from a leading chip vendor. The agreement means that mimoOn now supplies the majority of SDR chip vendors in the mobile terminals business.mi!MobilePHY™ is a complete 3GPP (Release 8) software stack supporting FDD and TDD. It’s implemented in C and designed for programmable system-on-chip platforms. mi!MobilePHY™ offers a flexible architecture to enable rapid implementation, typically delivering an initial prototype system within months. mimoOn is experienced on 6 different SDR mobile terminal architectures and several others are currently under evaluation.
According to Brian Robertson, VP Sales & Marketing, “The world’s largest SDR companies recognise that in-house development of SDR software for PHY stacks is too expensive and too slow. mi!MobilePHY offers a market-proven, fully compliant, easily configured and economical short-cut. In the race to win LTE market share, it gives our customers a significant time-to-market advantage.”
Related Semiconductor IP
- Band-Gap Voltage Reference with dual 2µA Current Source - X-FAB XT018
- 250nA-88μA Current Reference - X-FAB XT018-0.18μm BCD-on-SOI CMOS
- UCIe D2D Adapter & PHY Integrated IP
- Low Dropout (LDO) Regulator
- 16-Bit xSPI PSRAM PHY
Related News
- Omni Design Technologies Offers Swift™ Data Converters for Advanced Software Defined Radio (SDR) Solutions
- Siemens & Alphawave Semi partner for AI silicon IP
- X-Silicon Revolutionizes AI and Graphics at the Edge with “Constellation” Software Platform
- VESA® Approves Teledyne LeCroy DisplayPort™ 2.1 PHY Compliance Test Specification Software
Latest News
- Rambus Appoints Sumeet Gagneja as Chief Financial Officer
- SEMI Reports Worldwide Silicon Wafer Shipments Increase 13% Year-on-Year in Q1 2026
- POLYN Technology Announces Tapeout of Automotive Chip
- QuickLogic Establishes New Banking Relationship and Secures $10 Million Revolving Credit Facility
- TES is extending its PMU IP portfolio for X-FAB’s XT018 - 0.18µm BCD-on-SOI technology.