Is China's fabless model sustainable?
Junko Yoshida, EETimes
6/19/2012 9:11 AM EDT
BEIJING -- Let’s face it. China’s IC industry still lacks its own superstars – equivalent to Intel, Qualcomm or Broadcom in the West – in terms of the scale, reach and quality these brands possess on the global market.
To belabor the point, how many U.S. design engineers can name, say, the top 10 Chinese chip vendors destined to become their fierce competitors in three years from now? The question is tough because Chinese fabless companies, while growing fast, are still small. Many also remain faceless.
In contrast, a Chinese executive based in Beijing, speaking with ee Times, rattled off Spreadtrum, RDA Microelectronics, GalaxyCore and GigaDevice as his “top four” picks among local fabless companies likely to become key players in the smartphone IC ecosystem. The executive, heading up a U.S.-based chip company’s R&D team, believes that will happen not within the decade, but in just a few years.
Is he right?
To read the full article, click here
Related Semiconductor IP
- TSMC 7nm 0V75 / 0V9 ESD Local Clamp – Low Cap
- TSMC 65nm 3V3 ESD Local Clamp – Rad Hard
- TSMC 5nm 1V8, 1.2V and 0.9V ESD Local Protection – Low Cap
- TSMC 3nm 3V3 ESD Local Clamp
- TSMC 3nm 1V2 ESD Local Clamp – Low Capacitance
Related News
- iSuppli lists China's top fabless IC rankings
- Panelists question fabless model viability
- New semi model: fabless and designless
- China's Fabless Market Set to Double by 2015
Latest News
- First Benchmarks Revealed for Jalapeño, OpenAI’s Clean-Sheet General Purpose AI Accelerator ASIC
- MIPS Leads Open Standards Development for Physical AI Platforms as RISC-V International Premier Member
- SEALSQ’s Subsidiary IC'Alps Advances QASIC Roadmap for Sovereign, Quantum-Resistant Application-Specific Integrated Circuits
- NVMe 2.4 Update Adds Post-Quantum Security, Power Controls
- Agentrys Raises $24.5 Million to Build Agentic Design Automation for Chipmakers